Informasi produk
Bahan:
Housing: Dhuwur Termoplastik, UL94V-0
Werna: Werna ireng
Kontak: Paduan Tembaga, T = 0.15mm
Cangkang: Stainless Stee, T = 0.15mm
Rampung:
Kontak : 1u”-3u” Plating Emas Ing Area Kontak
Matte Tin 75u" Min Sakabèhé 50u" Nickel Undr
Dilapisi (Bebas Timah)
Cangkang : 50u” Min Matte Tin Sakabèhé 50u” Min Nikel
Under Plated (Bebas Timbal)
Coplanarity Antarane Terminal Lan Terus Down Of
Shell kudu 0.08mm MAX
Sadurunge: 1.00mm Pitch SHJP wire to board konektor KLS1-XF7-1.00 Sabanjure: 5.70mm Pitch Mega-Fit Power 170001 76825 76829 172064 Konektor Wire To Board KLS1-XM1-5.70